Zhongzhi Dingce C30
Chip-Level Die Reader
Chip-off recovery for NAND, eMMC, UFS, and EEPROM chips. Direct raw binary reading from die via specialized sockets to bypass all encryption, FTL firmware, and controller locks—the only reliable solution for failure analysis and forensic investigations. Ideal for burned/water-damaged devices, failed controllers, locked encryption, scrapped automotive head units, damaged drones, and malfunctioning industrial control systems.
Core Features
Bypass encryption
Directly read raw wafer data, bypassing all software encryption and controller locks.
Suitable for extreme scenarios
Data recovery possible even for devices damaged by fire, water, or mainboard failure
Raw Binary
Retrieve raw underlying data without FTL firmware interference
Multi-chip compatibility
Supports NAND, eMMC, UFS, EEPROM, and other storage chips
Technical Specifications
Use Cases
Zhongzhi Dingce's Core Tracks: Data Recovery, Forensic Investigation, and Accident Analysis for Extreme Failure Scenarios